| Type |
CPU / Microprocessor |
| Market segment |
Desktop |
| Family |
Intel Core i5 |
| Model number |
i5-650 |
| CPU part numbers |
- CM80616003174AH is an OEM/tray microprocessor
- BX80616I5650 is a boxed processor with fan and heatsink (English version)
- BXC80616I5650 is a boxed processor with fan and heatsink (Chinese version)
|
| Frequency |
3200 MHz |
| Turbo frequency |
3467 MHz (1 core)
3333 MHz (2 cores) |
| Bus speed |
2.5 GT/s DMI |
| Package |
1156-land Flip-Chip Land Grid Array (FC-LGA10)
1.48" x 1.48" (3.75 cm x 3.75 cm) |
| Socket |
Socket 1156 / H1 / LGA1156 |
| Weight |
0.9oz / 24.6g (CPU)
11.4oz / 324g (box) |
| Fan/heatsink |
E41997-002 |
| Introduction date |
January 7, 2010 |
| End-of-Life date |
Last order date is June 29, 2012
Last shipment date for tray processors is December 7, 2012 |
| Price at introduction |
$176 |
| S-spec numbers |
| |
ES/QS processors |
Production processors |
| Part number |
Q3GN |
Q4DC |
SLBLK |
SLBTJ |
| BX80616I5650 |
|
|
+ |
+ |
| BXC80616I5650 |
|
|
+ |
+ |
| CM80616003174AH |
+ |
+ |
+ |
+ | |
| Architecture / Microarchitecture |
| Microarchitecture |
Westmere |
| Processor core |
Clarkdale |
| Core steppings |
C2 (Q3GN, SLBLK)
K0 (Q4DC, SLBTJ) |
| CPUID |
20652 (SLBLK) |
| Manufacturing process |
0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die) |
| Die size |
81mm2 (CPU die)
114mm2 (IMC / graphics die) |
| Data width |
64 bit |
| The number of cores |
2 |
| The number of threads |
4 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
2 x 32 KB 4-way set associative instruction caches
2 x 32 KB 8-way set associative data caches |
| Level 2 cache size |
2 x 256 KB 8-way set associative caches |
| Level 3 cache size |
4 MB 16-way set associative shared cache |
| Physical memory |
16 GB |
| Multiprocessing |
Uniprocessor |
| Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- AES / Advanced Encryption Standard instructions
- EM64T / Extended Memory 64 technology / Intel 64
- VT-x / Virtualization technology
- NX / XD / Execute disable bit
- TBT / Turbo Boost technology
- HT / Hyper-Threading technology
- VT-d / Virtualization for directed I/O
- TXT / Trusted Execution technology
|
| Low power features |
- Thread C1, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology
|
| Integrated peripherals / components |
| Integrated graphics |
GPU Type: HD (Westmere)
Base frequency (MHz): 733
The number of supported displays: 2 |
| Memory controller |
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3 |
| Other peripherals |
- Direct Media Interface
- PCI Express 2.0 interface
|
| Electrical / Thermal parameters |
| V core |
0.65V - 1.4V |
| Minimum/Maximum operating temperature |
5°C - 72.6°C |
| Maximum power dissipation |
6 Watt (TDP in C6 state) / 170.83 Watt (peak)
128.71 Watt (sustained) |
| Thermal Design Power |
73 Watt |
| Notes on Intel Core i5-650 |
- Graphics processor and memory controller are located on a separate die, which is manufactured on 0.045 micron technology
- The processor has the following security, data protection and/or software features: Intel vPro technology.
- The CPU is compatible with Shader Model 4, along with DirectX 10.1 and OpenGL 2.1 APIs. OpenCL API is not supported.
- The graphics unit has the following software features enabled: Intel Clear Video HD technology.
|
